Dow’s Water-based Adhesive Received The Jung Innovation Award

On July 19, 2012, line ROBOND L-95D, the new member of water-based adhesives product that the Dow’s research developed, received the Ringier Technology Innovation Award.

Dow is pleased to offer a complete line of water-based dry bond laminating adhesives, the ROBOND L series, which meet a wide range of laminating adhesive needs, from general purpose label applications, to flexible laminations for food packaging, to applications requiring improved heat and chemical resistance. These products are VOC compliant, thus eliminating concerns around certain solvent-based chemistries.

The water-based single-component adhesive-epoxy(the CAS number is 61788-97-4 ) was debeloped together by the R & D center that Located in the U.S. and the technical center in Shanghai, adopting the Dow’s unique acrylic emulsion technology, eliminating the premixing process, completely avoiding the solvent emissions and significantly improve workplace safety, but also significantly improve the production efficiency of the processing enterprises. The product is suitable for both aluminized and transparent film substrate.

ROBOND L Generation 2 adhesives offer greater bond strength and chemical resistance to proceed to immediate slitting after the lamination. With excellent laminating performance even on CPP films and laminate constructions with aluminum foil, this new generation of adhesives is suitable for a broad range of substrates including films, foils, and paper. The laminations also endure pasteurization and aggressive filling goods, such as coffee or sauces.